The heat dissipation mechanism for the distribution box comprises thermal insulation boards disposed between two adjacent distribution board groups and capable of dividing a cavity into a plurality of sub cavities; upper and lower end surfaces of each thermal insulation board are. The utility model belongs to the high-voltage switchgear technology field, and especially relates to a heat dissipation mechanism for a distribution box. the chip) to the final destination, the atmosphere, in the context of an actual operating. Such as Figure 1-6 As shown, a heat dissipation mechanism for a distribution box provided by the present invention includes a distribution box housing 1, an air-cooled component, a water-cooled component, and a heat dissipation component; The distribution box housing 1 includes a. Distribution box is stored in a large number of electrical components or communication equipment, equipment for a long time in the process of work in addition to inevitably cause the distribution box internal temperature rise, will seriously affect the normal operation of equipment.
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