Recent Advances on Chip-to-Chip Optical Interconnect
This paper reviews the latest advances of optical interconnect for off-chip high bandwidth communications. The focus will be on the materials and processing aspects for realizing optical
Read MoreTungsten-copper bracket for communication optical modules
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Innovative alloys, like the new tungsten-copper material developed by Sirui New Materials, are emerging to address the intense heat in 400G+ modules. Our molybdenum-copper composites are most suitable for IGBT power modules and modern GaN or SiC MOSFET power transistors used in inverters of electric cars. Contrary to injection molding technology, Spectra-Mat's unique technology to infiltrate copper in an highly homogeneous sintered tungsten matrix guarantees the homogeneity of thermal conductivity of the tungsten copper submounts along the three axes, a very important requirement for multi diodes. These modules are essential for converting electrical signals into light signals and vice versa, forming the backbone of fiber optic communication systems in data centers. Sirui has its own physical and chemical testing center, the whole product production（ from raw materials into the factory testing, melting ratio, melting process monitoring and finished product processing）, can achieve instant testing, to ensure the quality of materials and products. The CommScope portfolio of Copper Solutions plays a crucial role in network connectivity, whether it's for voice telephony, high-speed data transmission, cable TV, or broadband access networks.